CHA Specs.docx

The CHA Mark 50 is an industry-standard high vacuum deposition system known for its simplicity, ease of operation, and unmatched reliability, making it an excellent choice for a wide range of applications. The system features a horizontal 32" by 32" water-cooled cylindrical chamber, facilitating easy loading and unloading. Its unique slide-down front door minimizes floor space requirements, and a rear door provides convenient access to the chamber from behind, allowing for through-the-wall mounting. The Mark 50 is SECS/GEM and CE compliant, ensuring compatibility with modern manufacturing standards. It offers dual operation capabilities for sputtering and evaporation, accommodates moving substrates, and provides exceptional film uniformity (fixture dependent). The system supports up to 4 process stations with round cathodes (RF or DC) and co-deposition capability. Additionally, it includes bias (RF or DC), substrate heating up to 400°C with multi-element options, electron beam, thermal deposition, ion beam pre-clean/etch, and plasma texturing/etch functionalities.
-Dual Operation, Sputtering and Evaporation
-Moving substrates
-Exceptional Film Uniformity (Fixture Dependent)
-Sputter Up
-Process Stations
-Round Cathodes, RF or DC (Up to 4 Stations)
-Co-deposit
-Bias, RF or DC
-Substrate heating, 400°C, multi-element
-Substrate heating, station
-Electron beam
-Thermal
-Ion beam pre-clean/etch
-Plasma texturing/etch

MARK 50

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