Description
Cu Barrier Seed depostionConfiguration
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEM Model Description
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.Documents
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LAM RESEARCH / NOVELLUS
INOVA
Verified
CATEGORY
Deposition
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
50644
Wafer Sizes:
12"/300mm
Vintage:
2014
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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LAM RESEARCH / NOVELLUS
INOVA
Verified
CATEGORY
Deposition
Last Verified: 14 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
50644
Wafer Sizes:
12"/300mm
Vintage:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Cu Barrier Seed depostionConfiguration
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEM Model Description
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.Documents
No documents