Description
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Plasma systems 400 and 660are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed.Documents
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PVA TEPLA
660
Verified
CATEGORY
Etch/Asher
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
77296
Wafer Sizes:
Unknown
Vintage:
2007
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Logistics Support
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Money Back Guarantee
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Refurbishment Services
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PVA TEPLA
660
Verified
CATEGORY
Etch/Asher
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
77296
Wafer Sizes:
Unknown
Vintage:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Plasma systems 400 and 660are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed.Documents
No documents